Keynote Speaker

Hirokazu Hashimoto, President and CEO, NEC Electronics Inc.

Mr. Hirokazu Hashimoto joined NEC Electronics Inc. in July 1998 as president and CEO bringing more than 32 years of experience to his position. As president and CEO, he is responsible for all of NEC Electronics’ North American semiconductor operations. Responsibilities include engineering, research and development, marketing, sales and support at the corporate headquarters in Santa Clara, the fabrication plant in Roseville, California (one of the largest and most advanced semiconductor plants in the United States), and the regional sales and ASIC support centers throughout the U.S. and Canada.
Mr. Hashimoto joined NEC Corporation in 1966 after receiving his Bachelor of Science degree in engineering from National Chiba University. He held various engineering positions at NEC Corporation until he was appointed general manager of the ASIC business unit for NEC Electronics in 1983. During his ten years at NEC Electronics Inc. he was promoted to vice president with added responsibilities for micro products and engineering. In 1997 Mr. Hashimoto was named vice president of NEC's semiconductor group, where he was responsible for supervising the solutions engineering and sales engineering divisions, the overseas semiconductor business, ASIC and special product lines.

Plenary Speakers

Behzad Razavi,
University of California, Los Angeles and Transpectrum Technologies
“Challenges in IC Design for Optical Communication Systems”

Behzad Razavi is a professor of electrical engineering at UCLA and the founder of Transpectrum Technologies, a company involved in the design of ICs for optical communications. Professor Razavi has published 100 papers and four books on the design of high-speed circuits. He is a distinguished IEEE speaker and has received awards at ISSCC, CICC, and ESSCIRC.
His paper describes the challenges in the design of high-speed, highly-integrated transceivers for optical communications. Following a system overview, the design of high-speed building blocks in bipolar and CMOS technologies is presented. Next, issues in the design of clock and data recovery circuits are introduced and methods of achieving high speed and low jitter are decribed. Finally, the challenges in integrating transceivers on one chip are reviewed.

Peter Robinson, API NetWorks
HyperTransport Technology for Networking”

Banquet Speaker

John Tanner,
Founder and CEO,
Tanner Research, Inc.
“Low Volume Manufacture of Chips, Boards, and Enclosures”

Despite the popular phrase, “System-On-A-Chip”, to really function as a system, each chip is mounted on a printed circuit board and each PCB is mounted in an enclosure. Tanner Research is best known for making chip design affordable through its software tools. In this talk, founder and CEO Dr. Tanner will discuss recent efforts at Tanner Research to make affordable integrated circuits and custom plastic enclosures in prototype and low manufacturing volumes. Traditional methods for tooling custom plastic parts can cost more than getting prototype integrated circuits. Tanner Research has attacked this problem through custom automation software.