Technical Program Committee:

Tughrul Arslan

University of Edinburgh, Scotland, UK

 

 

 

Richard J. Auletta

LSI Logic Corporation

 

Shi-Lien Lu

Oregon State University

James A. Barby

University of Waterloo, Canada

 

Martin Margala

University of Rochester

Azeez Bhavnagarwala

IBM T.J. Watson Research Center

 

James Meindl

Georgia Institute of Technology

Dave Braverman

NEC Electronics

 

Vasily Moshnyaga

Fukuoka University, Japan

Thomas Büchner

IBM Böblingen Development Lab, Germany

 

Sudhakar Muddu

 

Sumer Can

Maxim Integrated Products

 

P.R. Mukund

Rochester Institute of Technology

Jo Dale Carothers

University of Arizona

 

Prawat Nagvajara

Drexel University

Chien-In Henry Chen

Wright State University

 

Katsu Nakamura

Analog Devices, Inc.

Howard H. Chen

IBM T.J. Watson Research Center

 

Takao Onoye

Kyoto University, Japan

Mely Chen Chi

ITRI, Taiwan

 

Fabrice Paillet

DGA/DCE/CTA France

John Chickanosky

IBM Microelectronics

 

Peter Pirsch

University of Hannover, Germany

T. Raju Damarla

US Army Research Laboratory

 

Dionisios N. Pnevmatikatos

ICS FORTH, Crete, Greece

David England

Intel Corporation

 

Gerhard Roos

Fujitsu Microelectronics, Germany

Eby G. Friedman

University of Rochester

 

Christopher A. Ryan

Texas Instruments

Dong Ha

Virginia Tech

 

Mark Schrader

Eastman Kodak Company

Lei He

University of Wisconsin

 

Nanjunda Shastry

3Com Corporation

Wolfram Hardt

University of Paderborn, Germany

 

Jerry Sobelman

University of Minnesota

Masao Hotta

Hitachi, Japan

 

Ramalingam Sridhar

SUNY at Buffalo

Ken Hsu

Rochester Institute of Technology

 

Mircea Stan

University of Virginia

Suhwan Kim

IBM T.J. Watson Research Center

 

Myung Hoon Sunwoo

Ajou University, Korea

Ram K. Krishnamurthy

Intel Corporation

 

Cherrice Traver

Union College

Hyun Lee

Conexant Systems, Inc.

 

Chih-Kong Ken Yang

University of California - Los Angeles

Paul Lee

Eastman Kodak Company

 

Yuk Yung

Fujitsu Microelectronics

Technical Program Committee