14th Annual IEEE International ASIC/SOC Conference*
CALL FOR PAPERS
SOC IN A NETWORKED WORLD
September 12-15, 2001, Crystal City Hyatt Hotel, Washington, D.C.
Sponsored by the IEEE Circuits and Systems Society

Driven by the rapid growth of the Internet, communication technologies, pervasive computing, and consumer electronics,Systems-on-Chip (SoC) have started to become a key issue in today's electronic industry. The transition from the traditional Application-Specific Integrated Circuit (ASIC) to SoC has lead to new challenges in Design Methods, Automation, Manufacturing, Technology and Test.
The ASIC/SOC Conference provides a forum for sharing recent advances in VLSI/ULSI/GSI technology and design capabilities, and their application to meeting the engineering requirements for ASICs and SoCs. The 2001 Conference will offer three days of technical papers and a full day of technical workshops. The best presented paper will be acknowledged by a Best Paper Award.
Papers are invited which address new and previously unpublished developments in the following categories:
 

SoC Specific Design Methodologies

Applications

S1

Reusable & Embedded Cores/Macros, Memories

A1 

Communication, Networking, Internet, e-Business

S2

Technology Independent Methodologies

A2

Signal/Image Processing

S3

On-Chip Buses for SoC

A3

Multimedia

S4

Smart Sensors Integration

A4

Portable & Wireless Systems

S5

Library Development

A5

Microprocessors, Computers, Pervasive Computing

S6

Design of Reconfigurable SoC

A6

Consumer and Defense Electronics

Common Design Methodologies

A7

FPGAs and Reconfigurable SoC

D1

High Performance, Low Power Design

A8

Other SoC Applications

D2

Analog & Mixed-Signal Design

Enabling Technologies for SoC

D3

Wireless Communications Design

T1

Embedded DRAMs/Flash Memories

D4

Digital Signal Processing

T2

Sensors/MEMS

D5

Timing Methodologies, sync./async. design, clocking

T3

Deep Sub-micron Technologies, Cu, SiGe, SOI

D6

Reconfigurable/Scalable Design

T4

Optical Interconnects

Design Automation

T5

Reconfigurable SoC

DA1

System Interconnects, Interconnect Modeling, Signal Integrity

Manufacturing

DA2

Hardware/Software Co-Design, Verification

M1

Signal Integrity & EMI

DA3

High Level Design & Synthesis

M2

Packaging & I/O Interfacing

DA4

Logic Design & Synthesis

M3

SoC Testing, Power Measurement, Burn-In

DA5

Physical Design & Synthesis, IP Issues and Reuse

M4

SoC Fabrication Technologies

DA6

SoC Specific CAD Tools

Common SoC Issues

Verification

C1

Project Management, Distributed Development Teams

V1

Formal Verification

C2

Intellectual Property, Patent and Legal Issues

V2

Simulation and Modeling

C3

SoC Success Stories, Case Studies

V3

Design for Testability, Fault modeling, IDDQ

C4

Future SoC Trends and Limits

V4

Failure Analysis

C5

SoC Overview and Tutorial Papers

The paper must clearly state the advances proposed; therefore, sufficient results (measured or simulated) and diagrams must be presented to demonstrate the quality and originality of the contributed work. Submissions should clearly indicate the category (S1…C5; see above), include a 25 word  condensed abstract and a full paper (limited to five double-column IEEE format pages, including figures and references). Proposals for tutorial papers, half-day and full-day tutorials/workshops, and for panel sessions are also invited.
Send 3 copies of your paper, along with an electronic version (disk or CD-ROM) in PDF format to: 2000 ASIC/SOC Conference, 101 Lakeforest Blvd., #400-B, Gaithersburg, MD 20877, Fax: 301-527-0994, Email: wendyw@widerkehr.com. For questions on technical issues please contact the appropriate chairperson listed below.

DEADLINE FOR SUBMISSION: APRIL 13, 2001
NOTIFICATION OF ACCEPTANCE: MAY 25, 2001
FINAL CAMERA-READY PAPERS DUE: JUNE 30, 2001


For paper submission and updated conference information, please visit our web site at
http://asic.union.edu
or contact the ASIC/SOC Conference office at 301-527-0900 x104

Conference General Chair

Technical Program Chair

Steering Committee Chair

P. R. Mukund

John Chickanosky

Thomas Büchner

Rochester Institute of Technology

IBM Microelectronics

IBM Böblingen Lab, Germany

prmeee@rit.edu

chickano@us.ibm.com

tbuechner@de.ibm.com

Publications/Publicity Chair

Workshop Chair

Dong Ha

Ram Krishnamurthy

Virginia Tech

Intel Corporation

ha@vt.edu

ramk@hf.intel.com

*14th Annual IEEE International ASIC Conference

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Call for Papers